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Three-dimensional integrated circuit
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51	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-01 11:41:42 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
52	Foundry TSV Enablement For 2.5D/3D Chip Stacking Remi Yu, UMC Hot Chips 24 August 27, 2012 Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:43 Reconfigurable computing Fabless semiconductor companies Xilinx Semiconductor device fabrication Digital electronics Three-dimensional integrated circuit Field-programmable gate array CMOS Electronic engineering Electronics Integrated circuits
53	3D IC WORKING GROUP MEETING JANUARY 23, 2013 3D IC Working Group Meeting Agenda  1:30 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Project management Technology Electronics Electronic engineering Semiconductor device fabrication Three-dimensional integrated circuit 2.5D
54	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 16:24:43 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
55	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Department System Integration and Interconnection Technologies Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-07 07:58:50 Semiconductor device fabrication Integrated circuits Electrical engineering Semiconductor devices Photonics Integrated circuit packaging Three-dimensional integrated circuit Integrated circuit Printed circuit board Technology Electromagnetism Electronics
56	3D IC WORKING GROUP MEETING APRIL 14, 2014 3D IC Working Group Meeting Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-04-17 10:11:48 Semiconductor device fabrication Fabless semiconductor companies Advantest Three-dimensional integrated circuit Multigate device Microsemi Altera Microelectromechanical systems Technology Materials science Electromagnetism
57	3D IC Strategy and Application Requirements Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:54 Electronic engineering Computer hardware Fabless semiconductor companies Field-programmable gate array Three-dimensional integrated circuit DDR SDRAM Forwarding plane Memory bandwidth Altera Electronics Computer memory SDRAM
58	3D IC WORKING GROUP MEETING OCTOBER 22, 2014 3D IC Working Group Meeting Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:12:03 Three-dimensional integrated circuit Technology Deep reactive-ion etching Semiconductor device fabrication Microtechnology Materials science
59	Global Semiconductor Alliance Electrostatic Discharge (ESD) in 3D-IC Packages Version 1.0 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:21:51 Electrical breakdown Electrical safety Semiconductor device fabrication Electrostatics Electrostatic discharge Human-body model Three-dimensional integrated circuit Transmission-line pulse Through-silicon via Electromagnetism Integrated circuits Physics
60	3D-IC PACKAGING January 2015 3D-IC Leadership Team  Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-12-29 12:50:47 Fabless semiconductor companies Integrated circuits IMEC Leuven Three-dimensional integrated circuit Open-Silicon Xilinx TSMC Amkor Technology Semiconductor device fabrication Electronic engineering Electronics